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Effects of Film Thickness and Deposition Rate on the Diffusion Barrier Performance of Titanium Nitride in Cu-Through Silicon Vias
저자
Lee, Young-Joo; Yeon, Han-Wool; Jung, Sung-Yup; Na, Se-Kwon; Park, Jong-Seung; Choi, Yong-Yoon; Lee, Hoo-Jeong; Song, Oh-Sung; Joo, Young-Chang
학술지명
Electronic Materials Letters
출판/발행연도
2014
주제
요약
본 연구는 TiN 확산 방지막의 형태가 성능에 미치는 영향을 박막 두께와 증착 속도를 통해 조사했습니다. TiN 박막 두께 증가는 컬럼 성장으로 인해 구리 이동을 막는 데 효과적이지 않았으며, 10nm 미만의 TiN 박막은 느린 증착 속도에서 비정질 구조 형성을 통해 구리 확산 방지 성능이 우수했습니다.
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