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3차원 칩 적층을 위한 Cu pillar/Sn-3.5Ag 미세범프 접합부의 금속간화합물 성장거동에 따른 전단강도 평가

Author
곽병현, 정명혁, 박영배
Journal Title
대한금속·재료학회지
Publication Year
2012
Summary

This study systematically investigated the effect of thermal annealing on the in-situ growth characteristics of intermetallics and the mechanical strength of Cu pillar/Sn-3.5Ag microbumps. The growth of Cu6Sn5 and Cu3Sn phases increased linearly with annealing time following a diffusion-controlled mechanism, correlating with increased shear strength.

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