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Integrated Machine Vision을 이용한 LED Die Bonder 검사시스템
저자
조용규, 하석재, 김종수, 조명우, 최원호
학술지명
한국산학기술학회논문지
출판/발행연도
2013
주제
요약
본 연구는 LED 다이 본딩 공정의 정확도를 향상시키기 위해 머신 비전 기반의 측정 시스템을 개발하고, 에폭시 토출 및 어태칭 상태 검출을 위한 새로운 비전 알고리즘을 적용하였다. 실험 결과, 개발된 시스템은 X:-29㎛, Y:-32㎛, 회전오차 3도 이내의 높은 정확도를 보였다.
학술지 영향력
[한국산학기술학회논문지]
- KCI
- 0.95
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