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전류밀도에 따른 플립칩 Sn-Ag 솔더 범프의 Electromigration 손상기구 분석
저자
김가희, 손기락, 박규태, 박영배
학술지명
대한금속·재료학회지
출판/발행연도
2017
주제
요약
본 연구는 플립칩 Sn-Ag 솔더 범프의 전류밀도에 따른 Electromigration 손상 기구를 분석했습니다. 전류밀도가 높을수록 EM 파괴 시간이 짧아졌으며, 낮은 전류밀도에서는 pancake void propagation이, 높은 전류밀도에서는 Joule heating으로 인한 국부적인 용융이 관찰되었습니다.
학술지 영향력
[대한금속·재료학회지]
- CiteScore
- 1.8
- ES
- 0.00037
- JCI
- 0.24
- JCR
- 1.4
- KCI
- 0.85
- SJR
- 0.288
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