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Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with ENEPIG Surface Finish
저자
유지은, 김수종, 홍원식, 강남현
학술지명
대한용접접합학회지
출판/발행연도
2022
주제
요약
본 연구는 ENEPIG 표면 마감된 Sn-2.5Ag 솔더 조인트에서 전기 이동에 의한 금속간 화합물(IMC)의 성장 거동을 예측하는 모델을 제시하고, 실험 결과와 비교 분석하였다. 모델링 결과, 10 kA/cm2의 전류 밀도를 250시간 유지할 경우 IMC 두께가 4.2 ㎛ 증가하는 것으로 예측되었으며, 실제 실험 결과와 일치하였다.
학술지 영향력
[대한용접접합학회지]
- KCI
- 0.64
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